Xilinx PQFP (PQ44/PQG44) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 44-Pin PQFP (PQ44/PQG44) Keywords: pq44, pqg44, 44 pin, PQFP, package, mechanical drawing, specification Created Date:

Note: The zip file includes ASCII package files in TXT format and in CSV format. The format of this file is described in UG475 . Product updates, events, and resources in your inbox

Where to easily find Package Drawings. I program SMT P&P equipment and use XILINX part almost daily. We get new packages in often. Is there a database to find these are a search

Virtex®-7 FPGA Package Files. Spartan®-6 FPGA Package Files. Kintex®-7 FPGA Package Files. Virtex®-5 FPGA Package Files. Artix®-7 FPGA Package Files. Virtex®-4 FPGA

Xilinx PLCC (PC84/PCG84) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 84-Pin PLCC (PC84/PCG84) Keywords: pc84, pcg84, 84 pin, PLCC, package, mechanical

PK068 (v1.4) March 12, www.xilinx.com 2 Revision History The following table shows the revision history for this document. Notice of Disclaimer Xilinx PK068 TSSOP (VO20/VOG20) Package, Package Drawing Author: Xilinx, Inc. Subject: TSSOP (VO20/VOG20) Package dimensions Keywords:

Xilinx TQFP (TQ100/TQG100) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 100-Pin TQFP (TQ100/TQG100) Keywords: tq100, tqg100, 100 pin, TQFP, package, mechanical drawing, specification Created Date: 1/24/2000 9:44:00 AM

Package Drawings Package drawings are available online at the Package Drawings page on xilinx.com . Specifications and definitions Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").

Added Figure 4-37 the mechanical drawing for the Kintex-7 devices FFG1156 package. Also added some Virtex-7 device mechanical drawings in 

Device Package User Guide www.xilinx.com 9 UG112 (v3.7) September 5, R Chapter 1 Package Information Package Overview Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the

trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners. PK081 (v1.1) December 15, 2008. Fine-Pitch (FG484/FGG484) BGA